| Kyocera provides Optoelectronic Packaging, Fiber Optic Connector Hardware and Coupling Components solutions for applications ranging from high speed Ultra Long Haul transmission (DWDM, SONET/SDH, OC-768, OC-192, OC-48) to Metro, Access (DWDM, CWDM, SONET/SDH, Ethernet, OC-768, OC-192, OC- 48) and Subscriber Loop applications. Kyocera's Optoelectronic Packaging Products cover industrial standard formats such as Butterfly, RF Connector Type, MiniDIL, Modulator, OptoBGA and Submounts. Optical Connector Hardware and Coupling Components include Ferrules, Receptacles, Optical Isolators and Lensed Fibers. |  |  | |  Product line up | |  |  | |  | | | | Fiber Optic Connector Hardware and Coupling Components for high speed Optoelectronic Communications (DWDM, CWDM, SONET/SDH, Ethernet, OC-48, OC-192, OC-768) include Ferrules, Sleeves, Receptacles, Optical Isolators and Lensed Fiber. These critical components are manufactured utilizing Kyocera's High-precision Fine Ceramic Processing, Metallization, Bonding and Optical Alignment technologies. | | |  | |  | Ferrule | | Sleeve | | Receptacle | | Optical Isolator | | Lensed Fiber | | | | |  | | | | The OptoBGA is surface mountable and has excellent high frequency transmission performance.
| | |  | | | Surface mount millimeter wave package | | Excellent electrical performance | | | | | | | | | | | | | Multilayer ceramic butterfly type packages are a standard format for optical telecommunication transmission and pump laser diode modules. | | |  | | | Industrial standard package | | Open tool available | | | | | | | | | | | A differential pair line package provides high integrity transmission line properties for OC-768 and OC-192 use. | | |  | | | Excellent electrical performance | | Design flexibility | | | | | | | | | | | | | | The RF connector type package is used for high speed applications of OC-768 and OC-192. Precise RF connector joint technology results in excellent electrical performance. | | |  | | | Excellent electrical performance | | | | | | | | | | | The 10G Mini-FLAT package is designed for uncooled laser or photodiode modules used in OC-192 signal transmission. | | |  | | | Excellent electrical performance | | | | | | | | | | | | | | The MiniDIL package is suitable for uncooled laser diode, photo diode, and low power pump laser diode applications. | | |  | | | Excellent electrical performance up to 10G | | Industrial standard | | Open tool available | | | | | | | | | | | The enhanced thermal performance Mini-DIL package is suitable for photodiode, laser diode, or low power pump module applications requiring increased thermal conductivity. | | |  | | | High thermal performance | | | | | | | | | | | | | | The Mini-PIN ceramic package is a low cost solution for laser or detector modules in Access / Subscriber Loop applications and pin-compatible with the MiniDIL format. | | |  | | | Pin Compatible to Conventional 8 or 14 pin SDH Device | | Cost savings | | | | | | | | | | | Optical lenses such as Aspheric, GRIN, Hemisphere and Ball lens can be hermetically integrated to the package. | | |  | | | Various lens integration | | | | | | | | | | | | | | This single layer ceramic butterfly package is a low cost version of the multilayer ceramic package type. | | |  | | | 8pins or 14 pins | | Cost reduction | | Press ceramic technology | | High reliability | | | | | | | | | | | Reliability of this hermetic package is ensured by using glass to metal sealing technology for sealing the electrical pins. | | |  | | | Hermeticity | | High reliability | | Excellent cost performance | | Suitable for custom designs | | Available in tight pitches down to 1.27mm | | Lens integration possible | | | | | | | | | | | | | | Various submount materials include AlN, Quartz, Alumina, Silicon, SiC and Diamond. AuSn solder performs and matching resistors can be integrated. | | |  | | | Various Material options | | AuSn Eutectic Solder Thin Film Available | | Thin Film Resistor Available | | Side Wall Thin Film Available | | | | | | | | | | | Metal lids are available from Kyocera to fit a variety of package styles | | |  | | | Hermetic sealing | | | | | | | | | | | | | | Kyocera provides a CQFP package with excellent electrical characteristics for OC-192 transmission | | |  | | | Excellent electrical performance | | Design flexibility | | | | | | | | | | | RF-VIA package is a low cost, surface mount solution for broad band application (DC to millimeterwave). | | |  | | | Surface mount millimeter wave package | | Low cost | | DC to 40GHz | | Cost effective strip lead assembly | | | | | | | | | | | | | | Low Cost Ceramic wall package offers broad band performance at low cost. Kyocera offers full RF design optimization to meet product requirement. | | |  | | | Leadless carrier | | Low cost | | Excellent electrical performance | | | | | | | | | | | | | | | | Related link | | | | | | | |
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