Information about Atmel Corporation brand name.
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Green / Atmel RoHS and Green Packaging (Lead Free)
Atmel RoHS and Green Packaging (Lead Free)
Atmel began introducing Pb-free packages in the late 1990’s with our LAP laminate package family. Since then we have aggressively developed Pb-free or fully Green packages and now provide offerings in virtually every available package footprint in accordance with customer demand as well as legislative directives such as RoHS 2002/95/EC. Our Green Package Program is part of Atmel’s Corporate Environmental Policy.
Details of the Green Package Program are outlined in our Corporate Pb-Free / Green Packaging Policy (CPQ-2022). In general, Atmel uses Matte Sn plating with Tin Whisker Mitigation techniques as a standard for leadframe products with NiPdAu leadframes also available. Leadframe products are fully backward compatible to Pb-containing solder paste. For Ball Grid Array packages, SnAgCu solder balls are used and all reflow profiles are targeted to meet the latest revision of J-STD-020. All packages are topside marked to distinguish from Pb-containing versions using a single character code and labeling is targeted to meet JESD97 requirements.
